Advanced Electronics System Design & Engineering
We provide end-to-end Electronics System Design (ESD) and product engineering services for high performance, high reliability electronic products.
We support startups, technology companies, R&D organisations and product teams with focused engineering solutions or complete concept to prototype to production development.
Engineering design drawings, simulations & documentation outputs:
- Hardware specification and component selection
- Hardware architecture & block diagram
- Critical timing analysis and power sequencing graphs
- IPC7351 compliant component footprint library creation, management and ownership
- Detailed schematic design
- Electrical & mechanical BoM generation
- Enclosure / Box build design, prototype and fabrication design output
- Multi layer stackup design and impedance control calculations with table
- Single layer to multi layer HDI PCB layout – fabrication master drawing
- Flex and rigid flex PCB layout – fabrication master drawing
- Assembly drawing, pick and place file & test point report generation
- DFM & DFA review
- Engagement and coordination with suitable PCB fabricator & assembler
- WB-BGA / FCBGA IC substrate & RDL layout design – fabrication master drawing
- Wire bonding table & flip chip bump map table & I/O assignment
- WB / FC assembly drawing – die placement, bump array & assembly details
- Engagement & coordination with substrate fabricators and OSAT partners.
- Signal integrity analysis – S-Parameters, TDR/TDT, COM, NEXT/FEXT, Eye & Jitter
- Power integrity analysis - PDN, Impedance, IR Drop, Decoupling & Transients
- 3D EM simulation for RF structures, connector launch optimization & high frequency studies
- DFT strategy review
- BoN test fixture development with ICT, automated firmware programming and Functional Test (FCT)
- Thermal & reliability analysis – Junction temperature, heatsink sizing, power/thermal derating, PCB reliability & thermal cycling,
- EMI/EMC – Simulation, Pre compliance, shielding, grounding, filtering
- Laboratory characterization of embedded, RF & high speed hardware
- Test, validation & engineering report generation
Application Areas & Core Competencies:
- High speed interfaces including SerDes, IEEE 802.3 ck/dj (Ethernet), PoE, PCIe (gen 3-6), USB 3/4, DDR (upto 5), MIPI.
- IEEE P370 compliant fixture de-embedding design for high speed interconnects
- RF transceivers, Microwave systems, mmWave & Radar systems
- ASIC integration and FPGA based systems
- Wideband Software Defined Radio (SDR) design & integration
- Multi chip System in Package (SiP) integration, mSAP/SAP, BGA fine pitch substrates.
- Opto-electronic transceiver packaging & integration – Pluggable optics, NPO & CPO compliant with OIF standards
- High bandwidth platforms for 6G and datacom applications
- Wearable biomedical & flexible electronics like ECG, EMG, EEG, compliant with IEC60601
- Embedded, Mixed-Signal & Industrial IoT Electronics around MCU, Processors, FPGAs, wireless SoCs for control, monitoring, power management & edge sensing / processing tasks.
Technology & Product Development Partnerships
Our engagement model can be tailored to the client's needs:
- Engineering-as-a-Service: specialist support for SI/PI, RF, HDI, packaging, PCB or system-level challenges.
- Project-based Development: complete hardware development from requirements through validated prototype.
- NPI Support: engineering ownership through rapid prototyping, fabrication, assembly, validation and production readiness.
- Design Review & Rescue: independent review and troubleshooting of existing hardware facing SI, EMI, thermal, manufacturability or reliability issues.
- Technology Development: feasibility studies, PoCs and prototype platforms for emerging technologies.
- Extended Engineering Team: dedicated engineering capability integrated with the client's existing product-development organisation.
Our Value to Clients
We focus on more than delivering design files. Our objective is to deliver manufacturable, testable and commercially viable hardware.
By bringing system architecture, high-speed design, advanced packaging, simulation, prototyping, validation and manufacturing considerations into the same engineering workflow, we help clients:
- Reduce development and redesign cycles
- De-risk technically challenging products
- Improve first pass manufacturing success
- Optimise BOM and prototype costs
- Mitigate component and supply-chain risks
- Accelerate prototype to production transition
- Access specialist engineering capability without building a large in-house team
- Create scalable designs ready for NPI and volume manufacturing
From concept to validated hardware and from challenging interconnects to production ready electronics we provide the engineering depth required to turn complex electronic systems into manufacturable products.
For enquiry contact / whatsapp Mr. A. Mukherjee @ +918017399015 or +917980671759
